新一代高速服务器主板BGA共面度研究  

Investigating the BGA coplanarity of a next-generation high-speed server motherboard

作　　者：吴克威 黎钦源 向参军 郭峰[2] 孙龙[2] 张永甲 Wu Kewei;Li Qinyuan;Xiang Canjun;Guo Feng;Sun Long;Zhang Yongjia

机构地区：[1]广州广合科技股份有限公司,广东广州510730 [2]浪潮电子信息产业股份有限公司,山东济南250013

出　　处：《印制电路信息》2024年第S02期187-192,共6页Printed Circuit Information

摘　　要：文章旨在建立一种新一代高速服务器PCB主板BGA共面度设计及制作方法,确保服务器PCBA组装完成之后无因共面度问题导致的焊接应力开裂。通过研究服务器PCB主板设计特点,从图形分布、选材到PCB流程制作,包括层压及各工序的热处理,分析出影响共面度的主要因子,优化PCB制作方法,归纳出一套提高BGA共面度的设计及制作方法,为新一代高速服务器PCB项目的顺利开展提供设计及制造上的保障。This paper aims to establish a new generation of high speed server PCB board BGA coplanarity design and fabrication method to ensure that the server PCBA assembly welding stress cracking will not be caused by coplanarity problems.By studying the design characteristics of server PCB motherboard from graphic distribution,material selection to PCB process production,including pressing and heat treatment of each process,this paper analyzes the main factors affecting coplanarity,optimizes PCB production methods,and summarizes a set of design and production methods to improve BGA coplanarity to provide design and manufacturing guarantee for the smooth development of the new generation of high-speed server PCB project.

关 键 词：服务器 球珊阵列 共面度 投影波纹技术 

分 类 号：TN41[电子电信—微电子学与固体电子学]