软硬结合板PP偏位问题研究及改善  

Research and improvement of prepreg deviation for rigid-flex PCB

作　　者：黄大维 姚勇敢 Huang Dawei;Yao Yonggan

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2024年第S02期147-155,共9页Printed Circuit Information

摘　　要：对于工控类软硬结合板产品,板厚及层间介质层厚度通常都厚于消费类软硬结合板产品。由于介质层厚度较厚,软板层间通常选择多张2116PP。为实现软硬结合板产品的制作,软板层间的PP通常采用PP开窗或开缝的做法。对于单元内有多软板区设计的软硬结合板,PP开窗/开缝的位置多,导致在压板过程中,PP玻纤随着流动的树脂偏移,从而导致PP偏位问题。而当工控类软硬结合板产品同时叠加多软板区产品设计时,该现象愈加明显,进一步导致了软板流胶及揭盖玻纤残留问题的产生。本文主要对PP偏位产生的原因进行研究分析,并通过调整产品叠构、组合胶带等方案尝试解决PP偏位带来的软板流胶及玻纤残留问题。For industrial control class rigid-flex PCB,the board thickness and dielectric thickness are usually thicker than consumer class rigid-flex PCB.Due to the thick dielectric thickness,multiple 2116 prepreg are usually selected between layers.In order to achieve the production of rigid-flex PCB,Prepreg between the layers of rigid and flex usually adopts the practice of prepreg window open or slit.And for the unit with multiple flex area design,the number of prepreg window opening or slit is large.In the process of lamination,the PP glass fiber deviated with flowing resin.Resulting in PP deviation problem.When industrial control class rigid-flex PCB simultaneously superimposed with multiple flex area design.The phenomenon is becoming more and more obvious,which further leads to the problems of resin flow and glass fiber residue.This paper mainly studies and analyzes the causes of prepreg deviation,and tries to solve the problems of resin flow and glass fiber residue caused by prepreg deviation through adjusting product stack and composite tape.

关 键 词：软硬结合板 多软板区设计 组合胶带 玻纤偏位 软板流胶 玻纤残留 

分 类 号：TN41[电子电信—微电子学与固体电子学]