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作 者:雷川 雷璐娟 涂逊 毛先富 田忠源 Lei Chuan;Lei Lujuan;Tu Xun;Mao Xianfu;Tian Zhongyuan
出 处:《印制电路信息》2024年第S02期35-42,共8页Printed Circuit Information
摘 要:伴随以太网速率朝800 G、1.6T升级,PCB传输速率由56 Gbps向112 Gbps甚至224 Gbps演进。使得背钻Stub和D2M距离不断减小,对PCB背钻精度提出了巨大的挑战。传统的背钻控制方法已经不能满足高密度布线及高精度Stub对背钻的要求。本文旨在通过优化设计、提升对准度能力、降低通孔及背钻孔的孔位精度偏差、选择高精度机台等方案,将背钻Stub能力控制在0.1026±0.0508 mm,背钻对位能力提升至D+0.1524 mm的管控水平,达到降低Stub及减小背钻孔到周边线路的距离,提高高速高频PCB的传输速率。With the upgrade of Ethernet speed towards 800G and 1.6T,PCB transmission speed has evolved from 56Gbps to 112Gbps or even 224Gbps.The continuous reduction of the distance between the back drilling Stub and D2M poses a huge challenge to the accuracy of PCB back drilling.The traditional back drilling control method can no longer meet the requirements of high-density wiring and high-precision Stub for back drilling.This article aims to control the back drilling Stub capability at 0.1026±0.0508mm and improve the back drilling alignment capability to D+0.1524mm by optimizing the design,improving alignment ability,reducing the accuracy deviation of through hole and back drilling hole positions,and selecting highprecision machines,in order to reduce Stub and reduce the distance from the back drilling hole to surrounding lines,and improve the transmission speed of high-speed and high-frequency PCBs.
关 键 词:高速高频PCB 背钻 Stub 0.1026±0.0508 mm 对位D+0.1524 mm
分 类 号:TN41[电子电信—微电子学与固体电子学]
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