改善高填充体系覆铜板沟壑及除胶性能的应用研究  

Application research on improving the trench and resin removal capacity of Copper-Clad Laminate with high filling system

作　　者：刘涛 黄成 孟运东[2] 胡鹏 王路喜 肖文锐 Liu Tao;Huang Cheng;Meng Yundong;Hu Peng;Wang Luxi;Xiao Wenrui

机构地区：[1]江西生益科技有限公司,江西九江332000 [2]广东生益科技股份有限公司,广东东莞523000

出　　处：《印制电路信息》2024年第S02期8-13,共6页Printed Circuit Information

摘　　要：高填充体系覆铜板由于填料含量高,存在填料与树脂流动性不匹配,流动性差、沟壑的通性问题。本文研究了双环戊二烯苯酚环氧树脂在高填充体系(填料含量>40%)环氧玻纤布覆铜板中的应用,探究不同环氧当量的DCPD(双环戊二烯)苯酚环氧对板材性能的影响。研究结果表明,采用DCPD苯酚环氧搭配无卤低介电固化剂,并加入40%的填料制成的覆铜板,其T_(g)>160℃,T_(d)在400℃以上,阻燃满足UL 94 V-0级要求,随着环氧当量的升高,板材除胶性能和流动性提升,可有效改善沟壑情况,并具有优异的耐热性和介电性能。Since the high content of filler,the copper-clad laminate with the high-filling system has the problems of mismatch between the fluidity of the filler and the resin,poor fluidity and the passability of the gully.In this paper,the application of bicyclopentadiene phenol epoxy resin in high filling system(filler content>40%)copper-clad laminate with epoxy coated glass fiber was studied,and the effect of different epoxy equivalent amounts of dicyclopentadiene epoxy resin on the performance of the board was studied.The results show that the copper-clad laminate made of dicyclopentadiene epoxy resin with low dielectric curing agent and 40%filler content has a T_(g)>160°C,a T_(d)of more than 400°C,and the flame retardant meets the requirements of UL 94 V-0 level.The laminate has excellent heat resistance and dielectric properties.With the increase of epoxy equivalent,the resin removal capacity increases,and the fluidity of the plate improves,which can effectively improve the gully situation.

关 键 词：环氧当量 反应性 介电性能 除胶 

分 类 号：TN41[电子电信—微电子学与固体电子学]