抗镀金干膜对化学镍药水性能影响研究  

Research on anti gold plating dry film effect of chemical nickel solution

作　　者：杨智勤 王国辉 陆然 熊佳 魏炜 Yang Zhiqin;Wang Guohui;Lu Ran;Xiong Jia;Wei Wei(Greatech Substrate Co.,Ltd,Guangdong Guangzhou 510700)

机构地区：[1]广州广芯封装基板有限公司,广东广州510530

出　　处：《印制电路信息》2024年第S01期175-182,共8页Printed Circuit Information

摘　　要：本文主要研究化学镍钯金(Electro-less Nickel Electro-less palladium Immersion Gold,ENEPIG)+有机可焊性保焊膜(Organic Solderability Preservatives,OSP)选择性表面处理工艺使用的抗镀金干膜,对化学镍钯金化学镍药水性能的影响。经测试发现,测试抗镀金干膜A在化学镍药水溶液中UV在230 nm处扫描的ABS值随着干膜浸泡量的增加呈现上升趋势,证明干膜在化学镍药水中析出有机物成分。随着测试抗镀金干膜有机成分在化学镍药水中溶出量的增加,测试板化学镍的镀层沉积速率显著下降,发生磷含量增加、钯镀层漏镀、WB测试点脱、镀层peeling等品质问题,评估出测试干膜不适用于作为选择性化学镍钯金的抗镀干膜。同时通过化学镍的反应原理和药水分析,猜测为干膜中光引发剂和增粘剂等成分在化学镍药水中的溶出对化学镍反应产生影响。This article mainly studies the effect of ENEPIG(Electro-less Nickel Electro-less palladium Immersion Gold)+OSP(Organic Solderability Preservatives OSP)Selective surface treatment anti gold plating dry film on the Properties of Chemical Nickel Solution.After testing,it was found that the ABS value on UV scanning 230nm of electroless nickel solution Showing an upward trend as the dry film soaking amount increase.This paper proves that the dry film dissolves organic compounds in chemical nickel solution.As the amount of organic components increases in the dissolution of chemical nickel solution,the deposition rate of chemical nickel coating on the test board significantly decreases.There are quality problems such as phosphorus content increase,palladium coating leakage,WB Test point stripping,coating peeling,etc.The test dry film is not applicable as an anti-plating dry film for selective ENEPIG.By simultaneously analyzing the reaction principle and solution of chemical nickel,it is speculated that the dissolution of components such as photo-initiators and tackifiers in the dry film in chemical nickel solution affect the chemical nickel.

关 键 词：抗镀金干膜 化学镍钯金 有机物溶出 

分 类 号：TN41[电子电信—微电子学与固体电子学]