低轨卫星微波毫米波PCB的技术发展与应用  

Development and application of microwave and millimeter-wave PCB for LEO satellite

作　　者：袁欢欣 林旭荣 张学东 Yuan Huanxin;Lin Xurong;Zhang Xuedong

机构地区：[1]汕头超声印制板公司,汕头超声印制板(二厂)有限公司,广东汕头515065 [2]汕头超声印制板(三厂)有限公司,广东汕头515065

出　　处：《印制电路信息》2024年第S01期66-73,共8页Printed Circuit Information

摘　　要：低轨卫星移动通信系统与地面5G移动通信系统相融合,以及未来的6G时代,将推动构建全域内无缝覆盖和全时接入的通信网络、实现空天地海一体化。卫星通信向微波毫米波频段演进已成为发展趋势,与此同时也面临着更大的挑战。本文从互联网的概念入手,介绍了目前国内外低轨卫星技术发展及其应用进展,梳理了低轨天上端与低轨地面端两类PCB产品,阐述了用于降低PCB重量的低密度发泡材料PMI(聚甲基丙烯酰亚胺)混压加工技术、相关高频高速材料选型加工及其非对称结构的板翘控制技术、毫米波封装天线与阵列天线技术研究等关键技术,希望对低轨卫星工程推广和相关PCB加工制造产生一定的积极意义。Integration of low earth orbit(LEO)satellite mobile communication system and terrestrial 5G mobile communication system,and the future 6G era will be characteristic of a network integrating air,space,land and sea,thus providing genuine ubiquitous coverage.The evolution of satellite communication systems to the microwave and millimeterwave frequency band has become a development trend,and at the same time,it also faces greater challenges.Starting from the concept of the Internet,the development and application progress of LEO satellites are introduced.Then,typical two types of products of LEO sky transmitter(Tx)printed circuit board(PCB)and LEO ground receiving(Rx)PCB are sorted out.Finally,some key process technologies of LEO PCB are outlined,namely,low density foaming material PMI(poly methacrylimide)mixed pressing technology for reducing PCB weight,selection and processing of hybrid structure by high frequency and high speed base-materials and warpage control technology,millimeter-wave antenna-in-package(AiP)and array antenna technology study.It is hoped that the research will have some positive significance for the promotion of LEO satellite projects and PCB manufacturers.

关 键 词：低轨卫星 空天地一体化 印制板 毫米波通信 阵列天线 封装天线 

分 类 号：TN41[电子电信—微电子学与固体电子学]