板对板高速信号连接器对印制电路板及组装的挑战和解决方案  

Board-to-Board High-speed connector application challenges and solutions on PCB and PCBA

作　　者：胡高斌 谢佳峰 何波 黄小伟 蒲柯 Hu Gaobin;Xie Jiafeng;He Bo;Huang Xiaowei;Pu Ke(Lenovo Systems Technology(Shenzhen)Company Limited,518057)

机构地区：[1]联想系统集成(深圳)有限公司,广东深圳518057

出　　处：《印制电路信息》2024年第S01期50-58,共9页Printed Circuit Information

摘　　要：板对板高速信号连接器实现GPU加速卡和GPU模块板之间连接,以及主板与GPU和CPU的模块板之间的连接。本论文旨在探讨板对板高速连接器应用在印制电路板(PCB)和印刷电路板组装(PCBA)中的挑战,并重点关注此类板对板连接器在PCB布线设计改善和PCBA焊接可靠性提升方面的实验测试验证,找到合适的解决方案。通过对连接器对应PCB的盘中孔(VIPPO)焊盘和非盘中孔焊盘混合设计,以及VIPPO加背钻设计对PCBA表面焊接的挑战,影响及其可靠性进行深入研究;并探讨了混合VIPPO焊盘的PCB设计生产优化思路,PCB质量检测方式和PCBA焊接可靠性提升方面的实验及其接受标准。本研究采用了一系列实验和测试方法,包括PCB设计参数优化、材料选配及其加工工艺改进以及可靠性测试等,以验证连接器焊接在PCB中的可靠性和稳定性。研究结果表明,通过PCB设计和加工优化来促进PCBA焊接可靠性提升,显著提高整体系统的可靠性和稳定性,从而满足服务器主板和GPU模块互连的可靠性。本研究为此连接器在电子设备中的应用提供了实验方法和参考数据,对于服务器的PCB的设计和制作提供指引,对提升PCBA可靠性具有重要的参考意义.The board to board high speed connectors are commonly used on the Artificial intelligence(AI)infrastructure server board to board internconnections,which achieves the connection of OAM to UBB,GPU/CPU modules board to Motherboards,etc.The purpose of this paper was to investigate the reliability of this type of connector footprint design in printed circuit board(PCB)and the connector assembly to PCB,focusing on the experimental results of the connectors in PCB mixed VIPPO design,and VIPPO with backdrill design optimization,and to improve the print circuit board assembly(PCBA)soldering reliability performance.The challenges of this type of mixed VIPPO solder pad with the standard solder pad without VIPPO design were identified through dye and pry testing,post PCBA reliability testing.Then,the PCB design and manufacturing process was studied,and experiment to evaluate on the factors of PCB material,design layout and manufacture process,defined the proper solutions for PCBA soldering reliability improvement.The research results show that the reliability and stability of the overall system can be significantly improved through PCB design optimization and PCB material improvement,to meet the needs of the high-end server reliability requirements.This study provides important experiment methodology and test data for the application of the board-to-board connectors in electronic devices,PCB design guidelines,acceptance criteria discussions and recommendation in manufacturing as well,which are valuable for improving the performance and reliability of mixed VIPPO design components application.

关 键 词：板对板连接器 印制电路板 设计优化 盘中孔焊盘 焊接可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学]