一种动态热环境中印制电路板微形变控制研究  

Research on micro deformation control of Printed Circuit Board in a dynamic thermal environment

作　　者：唐昌胜 郭国栋 陈支武 Tang Changsheng;Guo Guodong;Chen Zhiwu

机构地区：[1]深南电路股份有限公司,广东深圳518117

出　　处：《印制电路信息》2024年第S01期9-18,共10页Printed Circuit Information

摘　　要：随着电子系统的复杂度持续提升,作为电子系统承载的印制电路板在集成度、布线密度以及轻薄化方向快速演进,越来越多种类的芯片直接贴附于印制电路板上,用以实现轻薄化、提升集成度。由于芯片本身轻薄特性,对热应力、机械应力等非常敏感,且印制电路板在SMT(Surface Mounted Technology:贴片指在印制电路板表面进行元器件或芯片贴装的技术)过程中处于长时间的动态热环境中,微形变不可避免,当未经封装的芯片在SMT制程中贴附于印制电路板表面上时,极易因为动态热环境中的微形变导致芯片断裂或起翘等失效。本文经过材料、结构、孔位等因素研究,可以通过前端设计的优化,实现印制电路板在动态热环境中的微形变有效控制,大幅降低芯片贴装到印制电路板上的起翘/断裂等失效,效果显著。With the continuous increase in complexity of electronic systems,printed circuit boards,as carriers of electronic systems,are rapidly evolving in terms of integration,wiring density,and lightness.More and more types of chips are directly attached to printed circuit boards to achieve lightness and improve integration.Due to the lightness nature of chips,they are highly sensitive to thermal stress,mechanical stress,and other factors.In addition,PCB are subjected to long-term dynamic thermal environments during SMT(Surface Mounted Technology),and micro deformation is inevitable.When unpackaged chips are attached to the surface of PCBs during the SMT process,It is highly susceptible to chip warping or fracture due to micro deformation in dynamic thermal environments.Through the study of factors such as material,structure,and hole handling,this article can achieve effective control of micro deformation of printed boards in dynamic thermal environments through front-end design optimization,which significantly reduce the failure of chip mounting on printed boards such as warping/fracture,and achieve significant results.

关 键 词：印制电路板 芯片 起翘 裂纹 材料 设计 控制 改善 

分 类 号：TN41[电子电信—微电子学与固体电子学]