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作 者:雷雨辰[1] Lei Yuchen
出 处:《印制电路信息》2024年第S01期316-318,共3页Printed Circuit Information
摘 要:DBC陶瓷板基材黄斑是陶瓷基板的常见问题,本文以自研的黄斑褪色溶液为基础,通过对黄斑褪色过程中的形貌进行能谱分析以及金相剖切,研究DBC基材出现黄斑的原因。结果表明,黄斑是在DBC制板时铜箔氧化层与陶瓷粉内的特定杂质在二者界面形成的一层极薄的共融层。基材黄斑处实质上含有一层极薄的铜,对产品的可靠性会存在一定的影响。The Yellow spot on the base material of DBC ceramic plate is a common problem.Based on the self developed Yellow spots fading solution,the appearance of Yellow spots during fading was observed by EDS and X-section,the causes of the Yellow spots was researched in this paper.The results show that,Yellow spot was formed from the process of DBC production.It came from the inter reaction of the copper foil oxide layer and the specific impurity in ceramic powder.The position of the Yellow spot contains a very thin layer of copper,and will have a certain impact on the reliability of products.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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