印制线路板背钻孔孔内无铜失效分析  

Failure analysis of the hole void on PCB back drilling

作　　者：李仕武 谢明运 Li Shiwu;Xie Mingyun

机构地区：[1]广州广合科技股份有限公司,广东广州510730

出　　处：《印制电路信息》2023年第S02期303-312,共10页Printed Circuit Information

基　　金：广州开发区黄埔区国际科技合作项目(2022GH14)

摘　　要：随着信息产业的不断发展推动,服务器平台不断的升级迭代,服务器类印制电路板上的背钻孔数量也越来越多,且厚径比也越来越高,在印制板生产过程中,背钻孔孔内无铜的发生概率也随之上升。因背钻孔中的原金属化孔形态已部分钻去不完整,损失了部分金属化孔孔内无铜缺陷形态的细节信息,提高了失效分析难度,因此急需建立有效的背钻孔孔内无铜分析方法。本文主要是通过对背钻孔孔内无铜案例的分析研究,探讨其产生原因与改善方法,并总结建立有效的分析步骤与方法,从而能快速定位这类问题的产生原因,指导下一步的纠正与预防改善。With the continuous development of the information industry and the continuous upgrading and iteration of server platforms,the number of back drilled holes on server type printed circuit boards is also increasing.In the production process of printed circuit boards,the probability of copper deficiency in the back drilled holes also increases.Due to the incomplete drilling of the original metallized hole morphology in the back drilling,the difficulty of failure analysis for copper free holes has been increased.It is urgent to establish an effective copper free analysis method for the back drilling hole.This article mainly analyzes and studies the case of no copper in the back drilled hole,explores its causes and improvement methods,and summarizes the establishment of effective analysis steps and methods,so as to quickly locate the causes of such problems and guide the next steps of correction,prevention and improvement.

关 键 词：印制电路板 背钻孔 孔内无铜 

分 类 号：TN41[电子电信—微电子学与固体电子学]