生产过程对PTFE板材D_(K)的影响因素研究  

Research on the influencing factors of the production process on the D_(k) of PTFE plate

作　　者：赵康 张志远 Zhao Kang;Zhang Zhiyuan(ShengYi Electionics Ltd Co.,Dongguan,Guangdong,China,523127)

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2023年第S02期70-78,共9页Printed Circuit Information

摘　　要：基于低成本和高性能考虑,类似汽车雷达阵列天线,都是由PTFE材料的PCB制成。相控阵天线,对材料D_(k)的稳定性有严格的要求,但实际产品D_(k)与设计的D_(k)存在较大差异。本文使用R公司的PTFE板材作为考察对象,对D_(k)差异的产生点及影响,进行了相关的研究,发现D_(k)偏差与线底侧蚀存在相关性,而线底侧蚀与各工序微蚀段或者有微蚀效果的药液有关,通过调整各段微蚀量,降低加工过程对板材D_(k)的负面影响。Based on low cost and high performance considerations,similar automotive radar array antennas are made of PTFE material PCB.The phased array antenna has strict requirements for the stability of the material D_(k),but the actual product D_(k) is very different from the design design D_(k).In this paper,the PTFE plate of R company is used as the object of investigation,and the relevant research is carried out on the generation point and impact of D_(k) difference,and it is found that D_(k) deviation is related to the line bottom side erosion,and the line bottom side corrosion is related to the micro-etching section of each process or the chemical solution with micro-erosion effect,and the negative impact of the processing process on the plate D_(k) is reduced by adjusting the micro-etching amount of each section.

关 键 词：阵列天线 介电常数 线底侧蚀 微蚀 

分 类 号：TN41[电子电信—微电子学与固体电子学]