印制电路板超薄铜箔表面粗化铜牙结构及制作技术  

Coarsened copper nodule structure and fabrication technology on ultra-thin copper foil surface of printed circuit board

作　　者：于鹏鹏 周国云 洪延 唐瑞芳 方蕾 Yu Pengpeng;Zhou Guoyun;Hong Yan;Tang Ruifang;Fang Lei

机构地区：[1]电子科技大学材料与能源学院,四川成都610054 [2]莆田市涵江区依吨多层电路有限公司,福建莆田351117

出　　处：《印制电路信息》2023年第S01期50-56,共7页Printed Circuit Information

基　　金：福建省科技计划项目资助(项目编号:2021H4006)

摘　　要：5G时代的到来,推动着印制电路行业不断向高频高速的方向发展,这也对电解铜箔提出了兼具“低粗糙度”与“高剥离强度”的要求,而这两者互相制约的关系对生箔的粗化处理技术成分布均匀的米粒状铜牙是评判粗化效果最直观的指标,而对铜牙形貌影响最大的就是各种添加剂的加入。添加剂A由某种炔烃类有机物和某种氯化物混合而成的溶液,是一种价格低廉、性能优异的电沉积铜粗化用添加剂,但是,目前研究中常用的电沉积铜粗化用添加剂仍然是价格较高的钨酸钠、羟乙基纤维素(HEC)等,关于添加剂A的研究却很少。故文章以添加剂A作为超薄铜箔粗化过程中的添加剂,探究其在铜牙制作过程中对微观形貌及粗糙度的影响,并进一步研究铜牙制作过程中添加剂A与常用添加剂钨酸钠复合使用的粗化效果。最终在自制的超薄铜箔上成功制备了分布均匀的米粒状铜牙,且超薄铜箔样品的表面粗糙度Sa仅为0.299μm,Sz仅为2.484μm。并得到了添加剂A与钨酸钠复合使用的最佳工艺配方。With the advent of 5G era,the printed circuit industry continues to develop in the direction of high frequency and high speed,which also puts forward the requirements of both"low roughness"and"high peeling strength"for electrolytic copper foil,and the mutually restrictive relationship between the two parts poses a great challenge to the coarsening technology of raw foil.For the ultra-thin copper foil used in mSAP process,the quality of coarsening even directly affects the performance of printed circuit boards.The most intuitive index to judge the quality of coarsening is whether the grain shape copper nodule with uniform distribution can be formed in the coarsening process,and the biggest influence on the morphology of copper nodule is the addition of various additives.Additive A,which is a mixture of certain alkynes and certain chlorides,is a cheap and excellent additive for electrodeposited copper coarsening.However,the commonly used additives for electrodeposited copper coarsening are still sodium tungstate and hydroxyethyl cellulose(HEC),which are relatively expensive.However,there is little research on additive A.Therefore,in this paper,A is used as an additive in the process of coarsening ultra-thin copper foil to explore its influence on the microscopic morphology and roughness in the process of copper nodule producing,and further study the coarsening effect of additive A combined with sodium tungstate,a commonly used additive,in the process of copper nodule producing.Eventually succeed produce grain shape copper nodule with uniform distribution in the prepared ultra-thin copper foil and the surface roughness of the ultrathin copper foil sample is low.The Sa is only 0.299 mm,and Sz is just 2.484 mm.Besides,the author finds the optimum process recipe of the additive A combined with sodium tungstate.

关 键 词：超薄铜箔 粗化 米粒状 铜牙 添加剂 

分 类 号：TN41[电子电信—微电子学与固体电子学]