等离子体处理聚四氟乙烯基材表面的机理研究  

Study on the mechanism of plasma treatment on the surface of PTFE

作　　者：孙改霞 焦其正 张志远 Sun Gaixia;Jiao Qizheng;Zhang Zhiyuan

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2023年第S01期385-392,共8页Printed Circuit Information

摘　　要：文章主要研究了等离子体改性处理,对PTFE板材表面的影响。采用粗糙度测试,接触角测试、XPS测试、ATR-FTIR测试、热应力测试等表征手段评估等离子体处理后板材表面性能变化。结果表明:经过等离子体处理后,PTFE表面粗糙度增加,非极性官能团含量降低,同时形成了一定含量的C-O、C=O、C=N等极性官能团,接触角降低,润湿性增强,PTFE基板与其他材料混压的压合可靠性增强。In this paper,the effect of plasma treatment on the surface of PTFE was investigated and the performance was analyzed by roughness test,contact angle test,XPS test,ATR-FTIR test,thermal stress test and other characterization methods.The results showed that:after the plasma treatment,the surface roughness was increased,the content of non-polar functional groups on the surface of PTFE decreased,and a certain amount of polar functional groups such as CO,C=O,OF were formed.Also,the contact angle was decreased,the wettability was enhanced,and the quality of the laminated reliability was improved.

关 键 词：PTFE板材 等离子体处理 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学]