基于数学模拟可视化解决电镀均一性问题  

Solve the problem of plating uniformity based on mathematical simulation and visualization

作　　者：司明智 袁锡志 张鑫梁 刘金峰 Si Mingzhi;Yuan Xizhi;Zhang Xinliang;Liu Jinfeng

机构地区：[1]深南电路股份有限公司,广东深圳518117

出　　处：《印制电路信息》2022年第S01期271-280,共10页Printed Circuit Information

摘　　要：电镀是PCB产品的生产过程中的核心流程,而电镀的核心点在于控制板件在镀铜过程中镀铜的均一性,所以对电镀而言控制镀铜均匀性至关重要。我们基于数学模拟的方法找到一种控制解决电镀均一性的方法,该方法不但能解决龙门电镀、垂直连续电镀线体电镀过程中均一性的问题,而且基于数学模拟可视化从源头优化设计电镀线体设备,使电镀线体在不同环境使用下都具有最佳的均一性效果。基于数学模拟的方法还能设计优化电力线分布,从而解决电镀过程中由于电力线分布所引起的板件外观等问题。Plating is the core process in the production process of PCB products,and the core point of electroplating is to control the uniformity of copper plating during the copper plating process,so it is very important for electroplating to control the uniformity of copper plating.The author found a method to control and solve the uniformity of plating based on the method of mathematical simulation.This method can not only solve the problem of uniformity in the plating process of gantry plating and vertical continuous plating line,but also optimize the design of plating line from the source based on mathematical simulation and visualization,so that the plating line body has the best uniformity effect under different environments.The method based on mathematical simulation can also design and optimize the power line distribution,so as to solve the problems of the appearance of the plate caused by the power line distribution during the plating process.

关 键 词：VCP电镀 龙门线电镀 均匀性方案设计 质量问题 

分 类 号：TN41[电子电信—微电子学与固体电子学]