8层任意层互连软硬结合板硬板焊盘到软板焊盘尺寸偏移改善研究  

Study of offset between rigid pattern and flex pattern on 8L anylayer rigid-flex board

作　　者：许明齐 陈建军 白杨 唐文鑫 Xu Mingqi;Chen Jianjun;Bai Yang;Tang Wenxin

机构地区：[1]广州美维电子有限公司项目开发部,广东广州510535 [2]广州美维电子有限公司,广东广州510535

出　　处：《印制电路信息》2022年第S01期167-177,共11页Printed Circuit Information

摘　　要：文章主要致力于8层任意层互连软硬结合板硬板焊盘到软板焊盘尺寸偏移的研究,硬板焊盘到软板焊盘尺寸偏移导致的电测踢板报废和客户零件贴装偏移的问题。通过分析尺寸超差板的分布规律,优化图形焊盘对位方式,减少层间累计偏差,以提升硬板焊盘到软板焊盘的尺寸对位能力,并通过调整对位标靶位置及新增对位标靶,校正超差位置的涨缩变形,进一步提升硬板焊盘到软板焊盘的尺寸对位能力,最终硬板焊盘到软板焊盘尺寸对位能力由Cpk=1.05提升至Cpk=1.63,电测踢板报废率降低7.53%,客户端未再反馈软板区零件贴装偏移问题。This paper is mainly committed to the research and improvement of the size offset between rigid pad and flex pad on 8L anylayer rigid-flex board.Aiming at the problems of scrapping of the kicking board of electric test and the offset of customer’s components caused by the size offset between rigid pad and flex pad,it analyzes the distribution law of set and performance of size out of tolerance,optimizes the alignment mode of image pad,and reduces the cumulative deviation between layers to improve the size offset capacity between the rigid pad and flex pad.And it corrects the expansion and contraction deformation at out of tolerance position by adjusting the position of alignment target and adding alignment target,which further improves the size capacity between the rigid pad and flex pad,and finally increases the size capacity between the rigid pad and flex pad from Cpk=1.05 to Cpk=1.63.The scrap rate of the kicking board of electric test is reduced by 7.53%.The customer has no feedback of the fitting offset of the components in the flex board area.

关 键 词：硬板焊盘到软板焊盘尺寸 激光钻孔对位 尺寸偏移 电测踢板 

分 类 号：TN41[电子电信—微电子学与固体电子学]