一种特殊刚挠结合产品的加工流程研究  

Research on the processing flow of a special rigid flex Printed Circuit Board

作　　者：叶卫聪 陈松 赵波吉 肖谋炎 Ye Weicong;Chen Song;Zhao Boji;Xiao Mouyan

机构地区：[1]东莞康源电子有限公司,广东东莞523932

出　　处：《印制电路信息》2022年第S01期161-166,共6页Printed Circuit Information

摘　　要：挠性层有沉金焊盘且外层使用纯铜箔和有大面积预开窗半固化片压合的刚挠结合板,在批量加工时常会遇到预开窗区铜箔破裂的情况,同时纯铜箔蚀刻开盖工艺不足以在外层蚀刻工序保护内层焊盘。文章介绍一类低成本、低风险、高效率、高品质的加工流程,使得此类产品更具备批量生产性。In the flexible layer,there is a rigid flexible bonding plate with gold pad and the outer layer using pure copper foil and large area pre-opening prepreg pressing.In the batch processing,the copper foil in pre-opening window area often breaks and bulges.At the same time,the pure copper foil etching and opening cover technology are not enough to protect the inner pad in the outer etching process.This paper introduces a kind of low cost,low risk,high efficiency,high quality processing flow,making this kind of products more efficient in batch production.

关 键 词：大预开窗 改善铜箔破裂 内层焊盘保护 降低成本 批量生产 

分 类 号：TN41[电子电信—微电子学与固体电子学]