封装基板机械钻孔性能研究  

Mechanical drilling performance study of IC substrates

作　　者：王淳 邹卫贤 金哲峰 Wang Chun;Zou Weixian;Jin Zhefeng

机构地区：[1]深圳市金洲精工科技股份有限公司,广东深圳518116

出　　处：《印制电路信息》2022年第S01期112-120,共9页Printed Circuit Information

摘　　要：各类封装基板板材自身的理化性质与其钻孔加工性能之间有着极大的联系,针对市面上主流的几种板材型号根据其加工磨损情况对其加工难度进行了分级,对最新的针对封装基板加工而研发的涂层微钻头的效果进行了验证。运用了部分DOE(实验设计)的方法进行响应曲面设计,以不同的加工参数为因子做响应实验。初步的研究结论显示,在加工封装基板时,以孔位精度为衡量标准优化出了最佳的钻孔加工参数,同时在一定条件下找到了板材性能参数Tg、CTE对加工性能的相关性影响。The physical and chemical properties of each type of packaging substrate and its drilling performance are highly correlated,and the main types of the substrates available on the market are graded according to their processing wear,and the effectiveness of the latest coated microdrills developed for packaging substrate processing is verified.A partial DOE(Design of Experiments)approach was used to design the response surface,and response experiments were conducted with different processing parameters as factors.The preliminary findings show that the optimal drilling processing parameters are optimized for processing package substrates with hole accuracy as a measure,and the correlation effects of the plate performance parameters of Tg and CTE on the processing performance are found under certain conditions.

关 键 词：印制电路板 PCB机械钻孔 涂层微钻头 实验设计 加工参数优化 

分 类 号：TN41[电子电信—微电子学与固体电子学]