高速材料低损耗关键质量控制研究  

Research on key quality control of high speed materials with low loss

作　　者：余少艳 罗畅 杜子良 Yu Shaoyan;Luo Chang;Du Ziliang

机构地区：[1]广州兴森快捷电路科技有限公司,广东广州510663 [2]深圳市兴森快捷电路科技股份有限公司,广东深圳518057

出　　处：《印制电路信息》2022年第S01期46-52,共7页Printed Circuit Information

摘　　要：“5G”时代为满足信息传输的高速低时延要求,25G高速材料应用急速拓展,对应PCB低损耗、信号完整性、批次间稳定性要求增加,加工管控要求增加,需对加工过程关键质量因素进行研究并控制。文章基于插入损耗研究,从不同材料的材料特性、配本,布线方式、旋转角,蚀刻因子,介厚均匀性,铜面粗糙度,背钻Stub长度等关键质量控制点进行分析,梳理出关键技术制作难点以及控制计划,为高速材料低损耗生产实现提供了方向指引。In 5G era,in order to meet the requirements of high speed and low delay of information transmission,25G high-speed materials are rapidly expanded in application,which increases the requirements of PCB with low loss,signal integrity,inter-batch stability and processing control.Therefore,it is necessary to study and control key quality factors in process.The article discusses the insertion loss,from different materials with different properties,material allocation,wiring way,rotation angle,etch factor,medium thickness uniformity,copper surface roughness,the key quality control points such as drill stub length.It concludes the key technical difficulties and control plan for the high speed low loss material production implementation and provides a realization direction.

关 键 词：高速材料 插入损耗 布线 蚀刻因子 STUB 

分 类 号：TN41[电子电信—微电子学与固体电子学]