浅谈真空二流体蚀刻设备在改良型半加成法工艺中的应用  

Application of vacuum & two fluid etching equipment on modified semi additive process

作　　者：王宏业 姚晓建 钮荣杰 王子初 Wamg Hongye;Yao Xiaojian;Niu Rongjie;Wang Zichu

机构地区：[1]广州美维电子有限公司制造工程部-新产品导入部,广东广州510535 [2]广州美维电子有限公司,广东广州510535

出　　处：《印制电路信息》2022年第S01期375-385,共11页Printed Circuit Information

摘　　要：随着电路板行业迅速发展,近几年越来越多的电路板厂引进了改良型半加成法(mSAP),而闪蚀(Flash etching)工艺则是其中一个关键环节,目前行业存在大部分蚀刻设备依然使用的普通蚀刻设备;文章着重对二流体真空蚀刻设备进行探究,具体通过三部分进行阐述,一是通过正交实验设计探究二流体段的气压与液压的最佳搭配;二是探究与对比分析真空段、二流体段与真空二流体闪蚀整线等三部分制作线路的线型和能力;三是探究真空二流体闪蚀设备制作不同线路(不同线宽/线距等级)的线型和能力。根据探究结果,二流体段的液压与气压需要在一定的比例搭配才能够制作到更好的线路,而真空段与二流体段搭配使用比真空段或者二流体段单独使用的制作线路效果更佳。With the rapid development of the circuit board industry,more and more circuit board manufacturers have introduced modified semi-additive process(mSAP)in recent years,while flash etching process is one of the key links.At present,there are common etching equipment still used by most etching equipment in the industry.This paper focuses on the vacuum two fluid etching equipment,which is described in three parts:first,the combination of air pressure and hydraulic pressure in the two fluid section is explored through orthogonal experimental design.The second is to explore and compare and analyze the line type and ability of the three parts of the line,including vacuum section,two fluid section and vacuum two fluid flash etching whole line.The third is to explore the line type and ability of vacuum two fluid flash etching equipment to make different lines(different line width/line spacing grade).According to the research results,the hydraulic pressure and air pressure of the two fluid section need to be matched in an appropriate proportion to make a better line shape,and the combination of the vacuum section and the two fluid section has a better effect than the vacuum section or the two fluid section alone.

关 键 词：改良型半加成法 真空二流体 线型 能力 

分 类 号：TN41[电子电信—微电子学与固体电子学]