5G高层印制电路板的背钻能力研究  

Research on ability of high precision back drill

作　　者：陈显任 向铖 梁满玲 付艺 宋晓飞 Chen Xianren;Xiang Cheng;Liang Manling;Fu Yi;Song Xiaofei

机构地区：[1]珠海方正科技多层电路板有限公司-F7,广东珠海519175

出　　处：《印制电路信息》2021年第S02期70-78,共9页Printed Circuit Information

摘　　要：电子设备的发展要求PCB高性能化、高速化。在高层高速PCB制作与设计中,信号传输性能是重中之重。随着高速材料在PCB制作中普遍应用,材料对信号传输的影响逐步得到改善。而作为影响信号传输速度与质量的背钻工艺,其STUB值控制能力普遍为≤0.3 mm,文章主要从排版设计与改善压合板厚均匀性,结合实验验证,探讨高速高层PCB背钻STUB值控制能力≤0.2 mm的解决方案。The development of electronic equipment requires high function and highspeed PCB in industry.The signal transmission performance is the first priority in consideration during design and production of high-layer count&highspeed PCB.With the application of highspeed materials in PCB industry,the influence of materials on signal transmission has been gradually improved.As a back-drilling process that affects signal transmission speed and quality,its STUB value control ability is generally≤0.3 mm.This text mainly discusses the solution of STUB value control ability≤0.2 mm for high-layer count&highspeed PCB from the layout design and board thickness uniformity optimization.

关 键 词：背钻 STUB 缓冲垫 硅胶垫 板厚均匀性 0.2 mm 

分 类 号：TN41[电子电信—微电子学与固体电子学]