不同激光模式下印制电路板铜/锡焊接效果的研究  

Investigation on the performance of Cu/Tin soldering of printed circuit board with different laser working modes

作　　者：方建荣 陈苑明 何为 檀正东 王海英 周旋 杨海妍 蔡始宏 李毅峰 续振林 Fang Jianrong;Chen Yuanming;He Wei;Tan Zhengdong;Wang Haiying;Zhou Xuan;Yang Haiyan;Cai Shihong;Li Yifeng;Xu Zhenlin

机构地区：[1]电子科技大学材料与能源学院,四川成都610054 [2]深圳市艾贝特电子科技有限公司,广东深圳518103 [3]厦门柔性电子研究院有限公司,福建厦门361101

出　　处：《印制电路信息》2021年第S01期139-146,共8页Printed Circuit Information

摘　　要：激光焊接凭借其三维非接触、局部加热和快速冷却等优点在电子封装/焊接中广泛应用,解决了手工焊接、回流焊等传统焊接工艺无法或很难解决的焊接问题。设计出线路为5 cm×0.5mm×35μm的印制电路测试板,在线路表面印刷锡膏后,研究温度模式和功率模式两种激光工作模式分别对锡珠飞溅、焊料堆积和焊料合金层烧焦等情况的影响,并对比了焊料合金层的表面粗糙度、空洞、表面3D形貌和界面IMC(金属间化合物)生长情况,经优化参数后获得较好的激光焊接效果。Laser soldering is widely used to solve the limitation of traditional manual soldering and reflow soldering in electronic packaging/soldering with the advantages of its three-dimensional non-contact,local heating and rapid cooling.A printed circuit test board is designed with fine circuit at the dimension of 5 cm×0.5 mm×35μm.After solder paste is printed on the circuit surface,two laser working modes of temperature mode and power mode are studied respectively for tin bead spatter,solder accumulation and solder alloy layer burning.Some comparisons of soldering are investigated including the analysis on the surface roughness,voids,surface 3 D morphology and IMC(intermetallic compound)growth of the solder alloy layer.After optimizing the parameters,a better laser soldering effect was obtained.

关 键 词：印制电路 激光焊接 非接触 焊锡效果 

分 类 号：TN41[电子电信—微电子学与固体电子学]