光模块PCB中高速材料的应用及关键加工技术探讨  

Application and key processing technology of high speed substrate materials in optical module PCB

作　　者：陈世金 梁鸿飞 韩志伟 徐缓 周国云[2] 陈苑明[2] 王守绪[2] 何为[2] 杨凯 张胜涛[3] 陈际达[3] Chen Shijin;Liang Hongfei;Han Zhiwei;Xu Huan;Zhou Guoyun;Chen Yuanming;Wang Shouxu;He Wei;Yang Kai;Zhang Shengtao;Chen Jida

机构地区：[1]博敏电子股份有限公司技术中心研发部,广东梅州514768 [2]电子科技大学微电子与固体电子学院,四川成都610054 [3]重庆大学化学化工学院,重庆400044 [4]博敏电子股份有限公司,广东梅州514768

出　　处：《印制电路信息》2021年第S01期80-85,共6页Printed Circuit Information

基　　金：梅州市引进重大科技创新平台和项目——基于5G通讯终端高速高散热印制电路关键技术及产业化(项目编号:2019A0102002)支持

摘　　要：5G技术日趋成熟,推动5G相关产品应用开始逐渐多起来了,通信市场和数通市场是光模块产品的两大应用领域,其对PCB及所使用的基板材料提出了越来越高的要求。基板材料的超薄化、高可靠性和低信号损耗是5G光模块产品的新要求,控制好尺寸精度、CAF、MFG、阻抗和信号损耗等是做好光模块产品的关键。文章将从光模块产品的加工、材料及可靠性检测等几方面讲述光模块PCB的控制要点,并对光模块PCB所使用的基板材料提出了新要求,以求能为业界技术工作者提供相关借鉴和参考。5G technology is becoming more and more mature,and the application of 5G is gradually increasing.The communication market and the digital market are the two major application leaders of optical module products.It puts forward the requirement for PCB and the base plate materials used,and the ultra-thin substrate material,high reliability and low signal loss are the new requirements of 5g optical module products.The key to do a good job in optical module products is to control the dimensional accuracy,CAF,MFG,impedance and signal loss.In this paper,the control points of optical module PCB are described from the aspects of processing,material and reliability testing of optical module products,and new requirements are put forward for the substrate materials used in optical module PCB,so as to provide relevant reference for technical workers in the industry.

关 键 词：光模块板 高速材料 印制插头 耐CAF 耐MFG 信号损耗 

分 类 号：TN41[电子电信—微电子学与固体电子学]