新型LED电子显示屏封装基板的生产关键技术研究  

Research on the key technology of the new type of LED electronic display screen packaging substrate

作　　者：叶汉雄 邱成伟 李焱程 Ye Hanxiong;Qiu Chengwei;Li Yancheng

机构地区：[1]惠州中京电子科技有限公司研发部,广东惠州519029 [2]惠州中京电子科技有限公司,广东惠州519029

出　　处：《印制电路信息》2021年第S01期52-60,共9页Printed Circuit Information

摘　　要：LED用电路板,是印制电路板的一种,是在导热性比较好的材料平面上印刷线路,再将电子元件焊接于上面,在高端光电设备、智能家居市场,LED灯类印制电路板的应用越来越广,我们这里所说的新型LED电子显示封装基板,主要是指小间距LED、MiniLED及LED灯珠封装电路板。目前主要以Pitch大小及封装方式进行区分。LED小间距显示成为带动行业景气度恢复的重要因素,未来随着成本的逐步下降,有望持续推动市场应用高增长。随着LED显示屏领域市场的扩大,尤其小点间距产品增产,文章主要阐述新型LED电子显示屏的封装基板量产化的关键技术。LED circuit board is a kind of printed circuit board,which is printed on the plane of the material with good thermal conductivity,and then welded with the electronic components on it.In the high-end optoelectronic equipment,smart home market,the application of LED lamp printed circuit board is more and more extensive.At present mainly it is by the pitch size and the package way to make distinction.LED small spacing display has become an important factor driving the recovery of the industry’s prosperity,and it is expected to continue to drive the market application high growth with the gradual decline of cost in the future.With the expansion of the market in the field of LED display screen,especially the production of small point spacing products,this paper mainly describes the key technology of packaging substrate mass production of new LED electronic display screen.

关 键 词：封装基板 LED 小间距 

分 类 号：TN41[电子电信—微电子学与固体电子学]