单晶硅棒等高硬脆性材料锯切线及其制备技术的现状与发展趋势  

Current Situation and Development Trend of Sawing Wire and Its Preparation Technologyfor High Hard and Brittle Materials such as Single Crystal Silicon Rod,Etc

作　　者：黄炜 徐金宝[1] 吕忠光 李振华 张国富 HUANG Wei;XU Jin-bao;LV Zhong-guang;LI Zhen-hua;ZHANG Guo-fu(Zhejiang LING ZHOU Intelligent Equipment Co.,Ltd.,Zhejiang Shaoxing 312000;Shaoxing Science and Technology Information Research Institute,Zhejiang Shaoxing 312000;ShaoxingTianlong Tin Materials Co.Ltd.,Zhejiang Shaoxing 312001)

机构地区：[1]浙江零轴智能装备有限公司,浙江绍兴312000 [2]绍兴市科技信息研究院,浙江绍兴312000 [3]绍兴市天龙锡材有限公司,浙江绍兴312000

出　　处：《世界有色金属》2023年第6期137-141,共5页World Nonferrous Metals

摘　　要：本文阐述了半导体和新能源用单晶硅、光伏硅片、蓝宝石等高硬脆材料锯切线及其制备技术的现状,分析了现有锯切线及其制备技术存在的问题,展望了钨合金基线锯切线及其制备技术研究的发展趋势,探讨了锯切线行业标准完善与相应的检验技术,为相关行业发展提供有益的参考。In this paper,it is described that the sawing wire and its preparation technology of high hard and brittle materials such as mono-crystalline siliconand photovoltaic silicon and sapphirefor semiconductor and new energy,and analyed that the problems of sawing wire and its preparation technology,andprospected the development trend of tungsten alloy sawing wire and its preparation technology.It is furtherdiscussed that the industrystandard perfected and relevanttesting technology for sawing wire.The article will provide useful reference for the development of the industries.

关 键 词：高硬脆材料 锯切线 现状与发展趋势 标准与检验 

分 类 号：TG58[金属学及工艺—金属切削加工及机床] TG74