低温固化无机有机杂化胶粘剂的制备及性能研究  

Preparation and properties of low temperature curing inorganic-organic hybrid adhesive

作　　者：荣立平 王刚[1] 张大勇[1] 朱金华[1] 李欣[1] 赵颖[1] 米长虹[1] 刘晓辉[1] Rong Liping;Wang Gang;Zhang Dayong;Zhu Jinhua;Li Xin;Zhao Ying;Mi Changhong;Liu Xiaohui(Institute of Petrochemistry Heilongjiang Academy of Sciences,Harbin 150040,Heilongjiang,China)

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040

出　　处：《中国胶粘剂》2022年第6期28-32,共5页China Adhesives

基　　金：黑龙江省科学院青年基金杰出项目(CXJQ2020SH01)

摘　　要：以正硅酸乙酯为前驱体,采用溶胶-凝胶法制备了一种硅杂化环氧树脂。配以适当的无机活性填料、催化剂、固化剂制备了一种无机有机杂化胶粘剂,并对其进行了表征。研究结果表明:该杂化胶的固化反应活性高于硅杂化树脂,可以低温固化,固化程度较高;杂化胶具有较好的粘接性能和较高的耐热稳定性,室温剪切强度最大值为12.9 MPa,400℃老化5 h后室温剪切强度最大值为7.7 MPa;经热环境使用后,杂化胶可发生二次杂化,耐热性能更佳。A silicon hybrid epoxy resin was prepared by sol-gel method with tetraethyl orthosilicate as precursor.An inorganic-organic hybrid adhesive was prepared with appropriate inorganic active filler,catalyst and curing agent,and then it was characterized.The research results showed that the curing reaction activity of hybrid adhesive was higher than that of silicon hybrid resin,which could be cured at low temperature and had a high degree of curing.The hybrid adhesive had good bonding properties and relatively high heat stability.The maximum shear strength at room temperature was 12.9 MPa,and the maximum shear strength at room temperature after aging at 400℃for 5 h was 7.7 MPa.After used in thermal environment,the hybrid adhesive could be hybridized twice and had better heat resistance.

关 键 词：杂化胶粘剂 低温固化 粘接强度 耐热性能 

分 类 号：TQ430.1[化学工程]