埋磁芯PCB生产工艺研究  

Study on the production technology of buried core PCB

作　　者：朱诗凤 周定忠 赵波 李清春 ZHU Shi-feng;ZHOU Ding-zhong;ZHAO Bo;LI Qing-chun

机构地区：[1]胜宏科技(惠州)股份有限公司,广东惠州516211

出　　处：《印制电路信息》2017年第A02期294-299,共6页Printed Circuit Information

摘　　要：介绍一种在印制线路板中埋入磁芯的新产品及其制造技术,且埋入磁芯边缘两侧实现空腔设计.将磁芯埋入印制线路板中减少或不使用表面贴装电感,使电子产品更加系统化和集成化,增加产品可靠性.文章初步探讨了此类埋磁芯印制线路板的制作流程及关键问题点技术难点,为此类印制板的后续开发提供参考意义.In this paper,a new product and its manufacturing technology are introduced,with the core embedded in the printed circuit board.The core is embedded in the printed circuit board to reduce or not use the surface mount inductor,SO that the electronic product is more systematic and integrated,and the reliability of the product is increased.In this paper,the production process and key technical points of the buried core printed circuit board are discussed.

关 键 词：埋磁芯 空腔设计 新产品 生产工艺 

分 类 号：TN41[电子电信—微电子学与固体电子学]