FPC水平化学沉铜工艺介绍及优化探讨  

Introduction and optimization discussion of FPC horizontal electroless-copper process

作　　者：黎坊贤 LI Fang-xian

机构地区：[1]深圳市贝加电子材料有限公司,广东深圳518102

出　　处：《印制电路信息》2017年第A02期248-254,共7页Printed Circuit Information

摘　　要：无电解铜层的导电性优异、孔壁结合力好、镀层可靠性高以及行业工艺熟悉度高等优势,使其化学沉铜始终在PCB/FPC制造过程占据着不可或缺的地位.水平设备的使用对于FPC制作过程的尺寸稳定性和制程能力优化具有非常重要的影响.水平化学沉铜应用于FPC制作孔金属化过程可以满足多层、刚挠结合及盲孔板等高端FPC产品要求.文章对FPC孔金属化使用水平化学沉铜工艺的经验进行介绍,从FPC水平化学沉铜各工序流程的品质管控和工艺优化措施进行探讨,希望能够对水平沉铜工艺在行业使用提供参考.Electroless-copper process occupies an indispensable position in PCB/FPC manufacturing for it’S advantages such as excellent conductivity,good hole wall adhesion,high reliability and process familiarity.The use of horizontal line takes very important influence on the dimensional stability and capability optimization of FPC manufacturing.FPC horizontal electroless—copper process can meet the requirements of high end FPC products,such as multilayer,rigid—flex and HDI—FPC.In this paper,it introduces FPC horizontal electroless—copper process based on the experiment.and discusses Off quality control and process optimization from each process flow,and hopes to provide reference for the use of peers.

关 键 词：挠性电路板孔金属化 水平化学沉铜 工艺优化 

分 类 号：TN41[电子电信—微电子学与固体电子学]