反应烧结碳化硅陶瓷素坯连接的研究  

Joining of Reaction-Bonded Silicon Carbide Ceramics in Green State

作　　者：武七德[1] 邓明进[1] 叶春燕[1] 吉晓莉[1] 孙峰[1] 

机构地区：[1]武汉理工大学硅酸盐材料工程教育部重点实验室,武汉430070

出　　处：《武汉理工大学学报》2008年第3期36-39,共4页Journal of Wuhan University of Technology

摘　　要：以碳化硅和碳为糊料的主要原料,采用素坯连接的方法焊接反应烧结碳化硅(RBSC)陶瓷。探讨了糊料的碳密度、固相体积含量以及碳化硅颗粒级配对焊缝显微结构和机械性能的影响。研究表明,糊料碳密度为0.845 g/cm3,固相体积含量达57%,焊料粘度略大于1 Pa.s时,连接素坯烧结后的焊缝强度可达375 MPa,焊缝具有和母材相似的显微结构是连接强度得以提高的主要原因。A method of joining green state with carbide and silicon carbide was applied to join reaction-bonded silicon carbide(RBSC) ceramics.The effects of carbonous density、solid volume loading and silicon carbide particle size distribution on the microstructures and mechanical properties of the welding seams were investigated.The results showed that the paste with carbonous density being 0.845 g/cm 3,solid volume loading being 57%,and the viscosity being over 1 Pa·s,the joining strength of the green body joints co...

关 键 词：反应烧结碳化硅 素坯连接 显微结构 

分 类 号：TQ174.1[化学工程—陶瓷工业]