耐高低温环氧有机硅胶粘剂的力学性能研究  

Mechanical property of high-and low-temperature resistant epoxy silicone adhesive cured at room temperature

作　　者：李芝华[1] 丑纪能[2] 邓飞跃[2] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083 [2]中南大学化学化工学院,长沙410083

出　　处：《化工新型材料》2007年第S1期123-125,共3页New Chemical Materials

基　　金：国家高技术研究发展计划(863计划)探索基金项目(项目编号2003AA84ts04)

摘　　要：介绍了一种研制的室温固化、耐高温、耐低温环氧有机硅胶粘剂。通过对胶粘剂的剪切强度分析,探讨了原料配比,偶联剂等因素对环氧有机硅胶粘剂力学性能的影响。研究表明:增韧剂在胶粘剂中含量适当时(质量比25%),能与固化剂充分反应,有机硅与环氧树脂也能获得较好的相溶性,制备的环氧有机硅胶粘剂的综合性能较优;硅烷偶联剂能改善胶膜界面层的胶接强度,提高环氧有机硅胶粘剂的剪切强度。In this paper,the high-and low-temperature resistant epoxy silicone adhesive cured at room tempera- ture was introduced.The influence of raw material ratio,coupling agent and other factors were discussed by researching shear strength of the adhesive.The results indicated:the properties of epoxy silicone adhesive reach to top as the tough- ener approaches 25%,the toughener reacted with the curing agent perfectly,and the epoxy had a good compatibility with silicone.The strength of interfacial layer is intensi...

关 键 词：环氧有机硅 剪切强度 耐高低温 增韧剂 偶联剂 

分 类 号：TQ430.1[化学工程]