小型平板CPL蒸发器耦合计算及优化设计研究  

CONJUGATE NUMERICAL SIMULATION AND PERFORMANCE OPTIMIZATION OF SMALL-SCALE FLAT CAPILLARY PUMPED LOOP EVAPORATOR

作　　者：万忠民[1] 刘伟[1] 

机构地区：[1]华中科技大学能源与动力工程学院,湖北武汉430074

出　　处：《工程热物理学报》2007年第z2期17-20,共4页Journal of Engineering Thermophysics

基　　金：国家重点基础研究发展规划资助项目(No.2007CB206901)

摘　　要：本文建立了小型平板CPL蒸发器毛细多孔芯内汽液两相流动与传热的模型以及金属外壁和工质区的导热模型,并进行耦合求解。分析了金属侧壁效应对蒸发器性能的影响,提出小型平板CPL存在着侧壁效应传热极限.数值结果表明,工质蒸发发生在多孔芯加热表面附近,蒸发器采用单一金属外壁时由于侧壁效应导致系统传热极限低,而上壁采用导热系数大,侧壁及下壁采用导热系数小的新型结构能够明显的提高系统的传热能力,同时使加热表面的温度维持在较低的水平.The numerical model for the small-scale fiat capillary pumped loop(CPL)evaporator is presented,which includes liquid and vapor flow,heat transfer and phase change in the porous wick structure and heat transfer in the fluid region and metallic wall,and the entire evaporator is solved with SIMPLE algorithm as a conjugate problem.The effect of heat conduction of side metallic wall on the performance of evaporator is analyzed,and the side wall effect heat transfer limit of flat evaporator is introduced.The numerical results show that the liquid evaporation occurs near the heated wick structure surface,and the metallic wall of evaporator with single material leads to low side wall effect heat transfer limit.The small-scale flat evaporator with combined wall which is composed of upper wall with high thermal conductivity and side and bottom wall with low thermal conductivity can increase heat transfer capacity greatly and maintain a suitable temperature level on the heated surface.

关 键 词：CPL 平板蒸发器 多孔介质 侧壁效应传热极限 耦合数值计算 

分 类 号：TK124[动力工程及工程热物理—工程热物理]