不同方法制备的螺旋线慢波组件的散热性能的研究  

Study of the Heat Dissipation of Slow-Wave Structure Assembled with Different Techniqus

作　　者：刘燕文[1] 韩勇[1] 赵丽[1] 王莉[1] 郑晓阳[1] 王晓艳[1] 王鑫[1] 赵建东[1] 赵世柯[1] 邓峰[1] 王自成[1] 刘濮鲲[1] 

机构地区：[1]中国科学院电子学研究所,北京100080

出　　处：《真空电子技术》2007年第4期35-37,48,共4页Vacuum Electronics

摘　　要：利用电阻温度系数法对冷弹压法、缠钼带热挤压法、石墨热挤压法、磁控溅射覆膜法及新型的无变形热挤压法制备的慢波组件散热性能进行了实验研究,结果表明石墨热挤压法、磁控溅射覆膜法和无变形热挤压方法比冷弹压法和传统的缠钼带热挤压法制备的慢波组件散热性能强许多。传统的石墨热挤压法可与无变形热挤压法制备的组件的散热能力相比拟,但石墨热挤压法会引起慢波组件的两次变形,使慢波组件的微波反射点增多增强,溅射镀膜法比无变形热挤压法制备的慢波组件散热性能强一些,但由于焊接法工艺的复杂性降低了其优势。这些结果为制备散热性能强的慢波组件提供了有益的实验结果。By using the new method,employing the variation in resistance-temperature coefficient of helix with temperature,the comparison of heat dissipation capability has been made among different helix assembling methods.A novel non-brazed helix assembly method is developed for improving heat dissipation in the slow-wave structure of helix TWT.The novel non-brazed helix assembly has not only stronger heat dissipation capability but also smaller microwave reflecting than that of conventional non-brazed helix assembly.The brazed helix assembly has a little stronger heat dissipation capability than that of novel non-brazed helix assembly,but its technology is complicated.

关 键 词：慢波组件 散热性能 挤压方法 焊接方法 

分 类 号：TN104[电子电信—物理电子学]