陶瓷电路板表面聚四氟乙烯薄膜制备工艺研究  

TECHNICAL STUDY OF QREPARE PTFE FILM ON THE SURFACE OF CERAMIC CIRCUIT BOARD

作　　者：张剑锋 郭云[1] 秦晓刚[1] 高原 

机构地区：[1]兰州物理研究所真空低温技术与物理国家级重点实验室,甘肃兰州730000

出　　处：《真空与低温》2007年第4期195-197,233,共4页Vacuum and Cryogenics

基　　金：真空低温技术与物理国家级重点实验室基金(9140C550201060C55)

摘　　要：采用硅偶联剂对TR组件(陶瓷电路板)表面进行改性处理,使得陶瓷电路板中的金属材料与聚四氟乙烯极性相近,通过射频磁控溅射在TR组件表面制备出聚四氟乙烯薄膜。XPS,SEM测试表明薄膜主要组成为聚四氟乙烯组分,薄膜形貌均一、致密。It is the study that prepare PTFE film in Surface of ceramic circuit board.Surface of ceramic circuit board is modified by resin acceptor,for the polarity of the metal material of ceramic circuit board is similar to PTFE.The essential component of the film is PTFE by testing of XPS and SEM,and the film is equal and compact.

关 键 词：陶瓷电路板 四氟乙烯薄膜 磁控溅射镀膜机 偶联剂 亲水性 疏水性 

分 类 号：O484.1[理学—固体物理]