微晶玻璃在电子封接中的应用  

Glass-ceramic application in electronic sealing

作　　者：韩滨[1] 周嶅[1] 祖成奎[1] 朱宝京[1] 陈江[1] 赵慧峰[1] 刘永华[1] 

机构地区：[1]中国建筑材料科学研究总院,北京100024

出　　处：《中国建材科技》2007年第3期34-36,共3页China Building Materials Science & Technology

摘　　要：概括了微晶玻璃的各项优异性能,微晶玻璃与金属封接的要求。介绍了微晶玻璃在电子封接中的典型应用,并按微晶玻璃的基础玻璃成分,介绍了国内外微晶封接玻璃的研究及应用,以及各类微晶玻璃系统的主晶相和热膨胀的特性。The various superiority performances of glass-ceramic and sealing demand of glass-ceramic to metal are revewed. The representative application of glass-ceramic in electronic sealing are introduced. disquisition of sealing glass-ceramic are introduced according to basic component. the various type glass-ceramic character of main crystalline and expand coefficient are introduced too.

关 键 词：微晶玻璃 封接 主晶相 膨胀系数 

分 类 号：TQ171.73[化学工程—玻璃工业]