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作 者:陈建升[1] 左红军[1] 高群峰[1] 范琳[1] 杨士勇[1]
机构地区:[1]中国科学院化学研究所高技术材料实验室,北京100080
出 处:《材料工程》2007年第z1期259-263,共5页Journal of Materials Engineering
摘 要:使用苯乙炔苯酐(PEPA),2,3,3 ′4′-联苯四酸二酐(a-BPDA),1,4-双(4′-氨基-2′-三氟甲基苯氧基)苯(BTPB)和1,4-对苯二胺(p-PDA)合成了设计分子量为1250的低聚物.通过核磁氢谱(1H-NMR)、基质辅助激光解析电离飞行时间质谱(MOLDI-TOF-MS)和红外光谱(FT-IR)对其化学结构和组成进行了表征;使用红外光谱对低聚物的固化特性进行了初步研究;考察了低聚物高温下的熔体粘度稳定性.研究结果表明低聚物是多组分混合物,混和二胺中对苯二胺具有更高的反应活性;苯乙炔基的固化交联反应速度在280℃时很慢,在371℃时非常迅速;低聚物在250~280℃时具有很好的熔体粘度稳定性,更高的温度下熔体粘度稳定性下降.Phenylethynyl terminated oligoimide with calculated molecular weight of 1250 was prepared by the polycondensation of the mixture of 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene(BTPB) and 1,4-diaminobenzene(p-PDA) with 2,3,3′,4′-biphenyltetracarboxcylic anhydride(a-BPDA) in the presence of 4-phenylethynylphthalic anhydride(PEPA) as endcap agent.The chemical structure and composition of oligoimide was characterized through 1H-NMR,Matrix-assisted laser desorption/ionization time-of-flight(MALDI-TOF) mass spectra,and FT-IR spectra.The cure behaviour of phenylethynyl group was characterized by FTIR,and the melt viscosity stability of the oligoimide was also investigated at elevated temperatures.Experimental results indicated that the oligoimide was mixtures containing a series of biphenylethynyl-endcapped oligoimide with different chemical structures and different molecular weight.The cure reaction rate of phenylethynyl group is slow at 280℃,and became rapidly at 371℃.In addition,the oligoimide showed high melt viscosity stability at 250-280℃,while with the temperature increased,the melt viscosity increased quickly.
分 类 号:TG146.4[一般工业技术—材料科学与工程]
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