IC封装中引线键合互连特性分析  

Character Analysis of Bond-Wire in IC Package

作　　者：周燕[1] 孙玲[2] 景为平[2] 

机构地区：[1]东南大学集成电路学院 [2]南通大学专用集成电路设计重点实验室

出　　处：《中国集成电路》2006年第11期55-57,60,共4页China lntegrated Circuit

基　　金：江苏省高新技术资助项目(BG2005022);南通大学自然科学基金资助项目(05Z115)

摘　　要：研究了芯片封装中键合线的建模和模型参数提取方法。根据二端口网络参量,提出了单键合线的"型等效电路并提取了模型中的R、L和C参量。最后,设计出一个简单、低成本的测试结构验证了仿真分析结果。The objective of this paper was to present a preparatory investigation of modeling of IC packages for chip-package co-design. The work was focused on the modeling and parameter extraction methods of bond-wires. Based on two-port parameters, a lumped Ⅱ-type equivalent circuit for a single-bond-wire was presented and the R, L, and C parameters of the bond-wire were extracted. Finally, a simple and low cost test structure was designed and made for validation of the parameterized model.

关 键 词：封装 键合线 建模 参数提取 去嵌入 

分 类 号：TN405[电子电信—微电子学与固体电子学]