化学镀Ni-P合金的工艺条件研究  

Investigation on electroless Ni-P alloy processing condition

作　　者：侯引平[1] 姜忠义[1] 李艳[1] 肖清贵[1] 

机构地区：[1]天津大学化工学院,天津300072

出　　处：《陕西师范大学学报（自然科学版）》2005年第S1期89-93,共5页Journal of Shaanxi Normal University：Natural Science Edition

摘　　要：采用单因素试验法和正交试验法研究了还原荆以及化学镀时间、温度、pH值对化学镀沉积速度的影响,得到了一种稳定性好、镀速快的化学镀Ni—P合金的工艺.其最佳工艺条件为:NiSO4·6H2O30g/L,NaH2PO2·H2O40g/L,柠檬酸钠10g/L,醋酸9mL/L,乳酸9mL/L,pH值6.0,施镀温度90℃,施镀时间1.5h.该工艺条件下,镀速可达11.14mg/(cm2·h),化学镀1.5h后镀层厚度可达23.6-24.0μm.镀层具有较强的耐蚀性,孔隙率分布较窄.镀层表面平整、光亮、分布均匀,有可视性很好的淡黄色的光泽,无麻点、裂纹、起泡、分层或结瘤等缺馅.The unitary factor testing and orthogonal testing method are both employed to study the influence of reducing agent consumption amount and processing time, temperature, pH on the plating deposition rate, the suitable electroless Ni-P alloy procesing condition is determined to obtain a high stability, high deposition rate. The optimization condition is: NiSO4·6H2O 30 g/L.NaH2PO2·H2O 40g/LCH3COOH 9 mL/L,pH 6.0 .Temperature 90℃ , Time 1.5 h. Under this condition, the plating rate was more than 11.14 mg/( cm2 ·...

关 键 词：化学镀 Ni—P合金 沉积速度 耐蚀性 

分 类 号：TQ153[化学工程—电化学工业]