引线框架用C194铜合金的软化温度研究  

Study on Softening Temperature of C194 Copper Alloy Applied to Lead Frame

作　　者：黄国杰[1] 程镇康[2] 谢水生[1] 马吉苗[2] 程磊[1] 

机构地区：[1]北京有色金属研究总院有色金属材料制备加工国家重点实验室,北京100088 [2]宁波兴业电子铜带有限公司,浙江宁波315301

出　　处：《稀有金属》2006年第z2期158-161,共4页Chinese Journal of Rare Metals

基　　金：国家863计划(2004AA3Z1460)

摘　　要：C194铜合金是最具代表性的引线框架材料之一。由于在引线框架材料的后续封装过程中材料需承受短时高温使用条件,所以对其软化温度提出了很高的要求。实验研究表明,C194合金采用分级时效工艺可以获得比单级时效更细小均匀的微观组织及更高的软化温度。相对于长时间的单级时效使得第二相粒子逐渐聚集并长大,分级时效工艺可以使得第二相粒子绕开先析出一部分未来得及长大的析出物而使析出粒子更加弥散、细小,使得软化温度提高约60℃。C194 copper alloy is one of the representative materials of lead frame.The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation.The results it show that split aging technique can get thiner and uniformer microstructure and higher softening temperature than the single-stage aging technique.The long-time single-stage aging technique makes the grains of the second-phase gather and grow up. And in the first age of the split aging technique the parts of the precipitated grains do not grow up in the short time.In the second age,the grains of the second-phase precipitate and steer the parts of the precipitated grains.So the grains can be thin and uniform,and softening temperature can be improves about 60 ℃.

关 键 词：引线框架 铜合金 C194合金 

分 类 号：TG166.2[金属学及工艺—热处理]