耐温热固性树脂胶粘剂的研究现状与发展  

Research Present State and Development Trend of Heat-resisting Thermosetting Resin Adhesives

作　　者：王丁[1] 江民涛[1] 郑典模[2] 程斌[1] 黄朝[1] 

机构地区：[1]江西省科学院应用化学研究所,南昌330029 [2]南昌大学,南昌330029

出　　处：《材料工程》2006年第z1期417-422,共6页Journal of Materials Engineering

摘　　要：综述了耐温热固性树脂胶粘剂的发展过程与研究现状,介绍近年来国内外几种性能优异的热固性树脂胶粘剂,提出现阶段耐温热固性树脂胶粘剂应该加强改性剂以及新型功能填料的研究,使胶粘剂由通用型向专用型转化。The research present state and the development trend of heat-resisting thermosetting resin adhesives were summarized.A few excellent heat-resisting thermosetting resin adhesives were introduced.It is indicated that the current development trend for this of adhesives should intensified the research of the modifying agent and the new type function padding,let the adhesives translate into tailored version from currency version.

关 键 词：耐温 热固性树脂 研究与发展 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]