铜系导电涂料中纳米铜粉抗氧化问题的研究  

Oxidation Resistance of Ultrafine Cu-Ag Bbimetallic Powders

作　　者：李哲男[1] 董星龙[1] 王威娜[1] 

机构地区：[1]大连理工大学材料系.大连理工大学纳米材料科学研究中心,辽宁大连116023

出　　处：《四川大学学报（自然科学版）》2005年第S1期226-230,共5页Journal of Sichuan University(Natural Science Edition)

基　　金：国家自然科学基金(50371012);辽宁省自然科学基金(20032125)

摘　　要：以水合肼为还原剂、PVP(聚乙稀吡咯烷酮)为分散剂,采用二月桂酸二丁基锡对纳米铜颗粒表面进行活化处理,然后采用置换反应法制备得到了与原纳米铜粉粒径和形貌大致相同的核壳型铜-银双金属粉末,采用XRD,XRF,TGA等手段,分析了核壳铜-银双金属粉的抗氧化性能,并用TEM对粉末形貌进行了表征.结果表明,经表面活化处理后得到的核壳铜-银双金属粉,在银含量较低(37.68%)时,也能形成完全包覆型结构,至700℃以下不被氧化.Firstly the surface of nano copper powders was activated by C_ 32 H_ 64 O_ 4 Sn, then The untrafine Cu-Ag bimerallic powders were prepared by chemical displacement reaction method in the presence of the activenano copper powders and the solution of AgNO_3. In this displacementreaction,Hydrazine hydrate served asreducer, and PVP as dispersant. The mean diameter and characterization of untrafine Cu-Ag bimetallic powders received were similar to the nano copper powders. Oxidation resistance of the powders was ...

关 键 词：纳米铜 表面活化 核壳 抗氧化性能 

分 类 号：TG174.4[金属学及工艺—金属表面处理]