Numerical Simulation of Residual Stress during Microlayer Composite Material Processing by EBPVD Technique  

作　　者：Liping SHI Yao LI Xiaodong HE 

机构地区：[1]Centerfor Composite Materials, Harbin Institute of Technology, Harbin 150001, China Centerfor Composite Materials, Harbin Institute of Technology, Harbin 150001, China Centerfor Composite Materials, Harbin Institute of Technology, Harbin 150001, China

出　　处：《Journal of Materials Science & Technology》2003年第z1期80-82,共3页材料科学技术（英文版）

基　　金：This work was supported by the Natural Science Foundation of Hei Longjiang Province (E01-07) and China Postdoctoral Science Foundation that support this research (LB0047).

摘　　要：The preparation technology of microlayer composite material by the electron beam physical vapor deposition (EBPVD) technique was briefly introduced. Taking the advantage of the large-scale commercial softvare of finite element analysis, areasonable physical model was built up during the deposition processing and the distribution of residual stress was analyzedbetween substrate and deposition layer or among deposition layers. The results show that: with the increasing substrate preheating temperature, the interlaminar shear stress increases but the axial residual stress decreases. The probability of curlingup after de-bonding tends to enhance as the thickness of deposition film increases.

关 键 词：MICROLAYER composite material  EBPVD  RESIDUAL stress  NUMERICAL simulation 

分 类 号：TB3[一般工业技术—材料科学与工程]