焊锡粉品质对回流焊时焊料球产生的影响  

Effect of Solder Powder Character on Inducing Solder Ball in Course of Refluence Soldering

作　　者：卢彩涛[1] 郭宏[1] 马自立[1] 张曙光[1] 杨必成[1] 杜文龙[1] 

机构地区：[1]北京有色金属研究总院,北京100088

出　　处：《中国稀土学报》2003年第z1期102-104,共3页Journal of the Chinese Society of Rare Earths

摘　　要：研究了焊粉导致焊料球(回流焊过程中残留在焊点周围的微小珠状焊料)产生的3个因素:氧化度、粒度以及焊粉中是否添加抗氧化元素。通过大量地分析检验证明,焊粉粒度范围越窄,氧含量越低,在回流焊中产生焊料球的机会越少,焊接质量越好,且通过对加入微量元素X的焊粉进行检测,及对此焊粉在回流焊中焊锡球(回流焊中焊料熔化后凝结成的焊点)表面进行成份分析,表明加入微量元素X可以起到抗氧化作用,使焊粉初始氧含量降低且放置时间延长。Three factors of inducing solder ball (Minuteness solder ball remaining around weld spot in the course of refluence soldering) solder powders: oxidation extent, granularity and appending another element to resist oxidation weather or not were studied. Proving by a lot of analysis and test to solder powder,if granularity range is more narrower and oxidation extent is more lower, solder ball is brought fewer in the course of refluence soldering. Even by testing solder powder character and analyzing surface element of solder tin ball(Coagulation of solder being melted in the course of refluence soldering) of appending element Ga, the result is resisting oxidation is produced, the originally oxidation content is reduced and the placed time of the powder is delayed in the air by appending element Ga to solder powder.

关 键 词：焊料球 焊锡球 氧化度 粒度 抗氧化 

分 类 号：TG433[金属学及工艺—焊接]