Life Prediction of Ball Grid Array Soldered Joints under Thermal Cycling Loading by Fracture Mechanics Method  

作　　者：Hongyuan FANG Li WANG Yiyu QIAN 

机构地区：[1]National Key Laboratory of Advanced Welding Production Technology,Harbin Institute of Technology,Harbin 150001,China

出　　处：《Journal of Materials Science & Technology》2001年第1期165-166,共2页材料科学技术（英文版）

基　　金：financially supported by the 211 Project fund of Harbin Institute of Technology.The contract number is 1805.

摘　　要：Fatigue crack propagation life of ball grid array (BGA) soldered joints during thermal cycling loading was investigated by fracture mechanics approach using finite element analysis. The relationships between the strain energy release rate (G) and crack size (a), thermal cycle numbers (N) can be derived.' Based on the relationships, fatigue life of the soldered joints was determined. The results showed that crack propagation life was higher than crack initiation life. Therefore, it appears that it is more appropriate to predict the fatigue life of soldered joints using the fracture mechanics method.Fatigue crack propagation life of ball grid array (BGA) soldered joints during thermal cycling loading was investigated by fracture mechanics approach using finite element analysis. The relationships between the strain energy release rate (G) and crack size (a), thermal cycle numbers (N) can be derived.' Based on the relationships, fatigue life of the soldered joints was determined. The results showed that crack propagation life was higher than crack initiation life. Therefore, it appears that it is more appropriate to predict the fatigue life of soldered joints using the fracture mechanics method.

分 类 号：TG40[金属学及工艺—焊接]