DAIP改性环氧树脂研究  

Investigation of Improved Epoxy Resins with DAIP

作　　者：宋宁[1] 乐韬睿[1] 王家梁[1] 倪礼忠[1] 

机构地区：[1]华东理工大学材料科学与工程学院,上海200237

出　　处：《功能高分子学报》2004年第2期171-175,共5页Journal of Functional Polymers

摘　　要：采用共固化的方法,得到酚醛环氧树脂(F-51)和间苯二甲酸二烯丙基酯(DAIP)的共固化树脂。实验结果表明:DAIP的加入降低了F-51环氧树脂的粘度[体系粘度为150～350mPa·s(25℃)],利于工艺操作;提高了F-51环氧树脂的耐热性,热变形温度达200℃。研究了F-51环氧树脂和DAIP共固化的固化行为、不同配比对共固化物形态结构的影响;并研究了不同配比对固化物耐热性的影响。A co-cure method of novolac epoxy resin(F-51)and diallyl isophthalate(DAIP) were used to enhance the heat resistance of epoxy resins. It shows that the heat resistance of F-S1 epoxy resin is improved remarkably and the viscosity of the resin system decreased notably( the thermal distortion temperature of the co-cured system is up to 200℃) ;and the viscosity of the resin was decreased (viscosity of resin system fall to 150～350 mPa·s ,25℃) to improve their process ability. Cure behavior of F51epoxy resin and DAIP was studied by DSC. The influence of the different compositions on the co-cure resins morphosis and the heat resistance were researched.

关 键 词：间苯二甲酸二烯丙基酯 酚醛环氧树脂 改性 共固化 耐热性 涂料 粘合剂 

分 类 号：TQ633[化学工程—精细化工] TQ433.437