Ni-P-金刚石化学复合镀研究工艺对镀层硬度的影响  

Effect of electroless Ni-P-Diamond composite plating parameters on the micro-hardness of coating

作　　者：李立明[1] 邵建兵[2] 朱永伟[2] 

机构地区：[1]郑州电力高等专科学校机电工程系,河南郑州450004 [2]南京航空航天大学机电学院,江苏南京210016

出　　处：《金刚石与磨料磨具工程》2009年第1期27-31,共4页Diamond & Abrasives Engineering

基　　金：国家自然科学基金项目(50675104);江苏省六大人才高峰基金项目(06-D-024)

摘　　要：在镍磷化学镀的基础上,研究了微米、纳米金刚石化学复合镀工艺。采用正交试验方法,研究化学镀液、金刚石种类与浓度、表面活性剂种类与含量以及热处理温度等因素对镀层显微硬度的影响。结果表明:对镀层硬度影响明显的因素依次为金刚石种类、表面活性剂种类、热处理温度和表面活性剂含量,而镀液种类和金刚石浓度对镀层硬度的影响较小。最佳工艺为:金刚石为纳米金刚石灰粉,添加阴离子表面活性剂,热处理温度为350℃,表面活性剂含量为1∶10,选用化学镀液B,金刚石浓度为6.0g/L。On the basis of electroless Ni-P plating,the techniques of electroless Ni-P-diamond composite plating were studied.The effect of electroless plating solution,the sort and concentration of diamond,the sort and content of surfactant and heat treatment temperature on the micro-hardness of coating was studied through orthogonal design.Results show that the factors affecting the hardness of coating are,in order of significance,sort of diamond,sort of surfactant,heat treatment temperature and content of surfactan...

关 键 词：金刚石 化学复合镀 正交设计 硬度 

分 类 号：TG74[金属学及工艺—刀具与模具]