电子封装用复合导热绝缘环氧胶粘剂的研制  

A Composite Thermal Conductive Insulating Epoxy Adhesive Material for Electronic Package

作　　者：张秀菊[1] 李波[1] 林志丹[1] 王勇[2] 吕丽霞[1] 许吉庆[1] 郑少杰[1] 

机构地区：[1]暨南大学理工学院材料系,广州510632 [2]深圳市博恩实业有限公司,广东深圳518109

出　　处：《绝缘材料》2009年第1期1-4,14,共5页Insulating Materials

基　　金：暨南大学引进人才项目(51207019)

摘　　要：以环氧树脂E-44为基体,通过加入不同量和种类的导热绝缘填料氮化硅、氮化硼、氧化铝、碳化硅来调节胶粘剂的导热性能,通过加入不同量的增塑剂来调节胶粘剂的粘度和韧性以适应于工业化涂布生产。重点研究了胶粘剂的粘度、导热性等性能与配方之间的关系,确定了一种适合于工艺生产、综合性能良好的电子封装用导热绝缘环氧胶粘剂。当复合填料中氮化硅、氧化铝、氮化硼的质量分数分别为环氧树脂基体的25%、25%、10%时,体系的导热率最高为2.66 W/m.K,为纯环氧树脂基体的11.6倍。An adhesive material was developed in which E-44,a widely used epoxy resin was used as matrix,and silicon nitride,boron nitride,aluminum oxide and silicon carbide were used as thermal-conducting insulating fillers.The thermal conductivity was adjusted by adding various amounts and types of materials mentioned above and the viscosity and toughness were modulated with the addition of various amounts of plasticizers and accelerators.The relations among the adhesive viscosity,heat conductivity and compounding f...

关 键 词：环氧树脂 导热绝缘填料 导热系数 

分 类 号：TN405[电子电信—微电子学与固体电子学]