镁合金直接化学镀镍的初始沉积机制  

Initial Deposition Mechanism of Direct Electroless Nickel Plating on Magnesium Alloy

作　　者：向阳辉[1] 胡文彬[1] 沈彬[1] 赵昌正[1] 丁文江[1] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室,上海200030

出　　处：《上海交通大学学报》2000年第12期1638-1640,1644,共4页Journal of Shanghai Jiaotong University

摘　　要：镁合金直接化学镀镍是其表面处理的一种方法 .通过 XPS、SAM和 SEM对化学镀镍的初始沉积机制进行了研究 .结果表明 ,镍的初始沉积是在活化中形成的氟化膜层下面 ,按照电化学的方式在第二相上形核的 .沉积过程与表面氧化物在镀液中的溶解和基底与镍离子的置换反应有关 .Direct electroless nickel plating is a method for plating on magnesium alloy. The initial deposition mechanism of nickel was studied by means of XPS, SAM and SEM. The results show that the initial deposition takes place on the second phase of the alloy, which is an indication of electrochemical deposition. The nickel nucleates beneath the fluoride film formed during activation, which is related to the dissolution of surface oxide into the plating bath, and the replacement reaction between the substrate and nickel ion.

关 键 词：化学镀镍 镁合金 初始沉积 

分 类 号：TQ1[化学工程] 53.1+2