雷达用E弯波导体精密挤压成形工艺  

Precise Extrusion Process of E Shaped Waveguide Component for Radar Use

作　　者：弭光宝[1] 王清瑞 薛克敏[3] 李萍[3] 

机构地区：[1]清华大学机械工程系,北京100084 [2]北京航空材料研究院,北京100095 [3]合肥工业大学材料科学与工程学院,合肥230009

出　　处：《北京工业大学学报》2009年第7期870-875,共6页Journal of Beijing University of Technology

基　　金：国防科工'十一五'规划项目资助(070301D2);安徽省优秀青年科技基金(04044058)

摘　　要：雷达用E弯波导体对内腔尺寸精度要求很高,主要采用机加工方式生产,材料利用率和生产效率都很低.基于精密塑性成形技术对该产品进行CAD/CAE/CAM模具设计,开发出了E弯波导体的精密反挤压成形工艺.结果表明:通过合理控制成形过程的工艺参数,可有效避免产生缺陷,稳定地加工出符合要求的波导体,且制品的显微组织致密、细小,性能更加优异;E弯波导体的新成形工艺可节约工时85%,节约原材料81.7%,具有优质、高效、低成本、低污染的特点.There is a high dimensional accuracy requirement for inner surface of E shaped waveguide component for rader use.Now mainly using machining to produce such parts,the material utilization ratio and productive efficiency are very low.Based on the technology of precise plastical forming,the die is designed by CAD/CAE/CAM,and precise backward extrusion process for E shaped waveguide component has been developed.The result shows that through analyzing and controlling the process parameters,defects can be avoided...

关 键 词：LF21铝合金 E弯波导体 精密反挤压 工艺参数 

分 类 号：TG376[金属学及工艺—金属压力加工]