植入式双面柔性神经微电极制作方法的研究  

Study on Fabrication Method of Implantable and Flexible Double-side Microelectrodes for Neural Applications

作　　者：周洪波[1] 李刚[1] 金庆辉[1] 赵建龙[1] 任秋实[2] 

机构地区：[1]中国科学院上海微系统与信息技术研究所 [2]上海交通大学激光与生物医学研究所,上海200030

出　　处：《微细加工技术》2007年第3期54-59,共6页Microfabrication Technology

基　　金：国家973计划资助项目(2005CB724305);上海市科委资助项目(06XD140370652nm016);上海-应用材料研究与发展基金资助项目(06SA01)

摘　　要：为了减小植入损伤,提高神经微电极刺激或记录的空间密度,提出了一种基于聚合物基质材料的植入式双面柔性神经微电极的制作工艺和方法。该方法采用光敏型聚酰亚胺(Durimide7510)作为微电极的基质材料,通过粘结剂局部键合和电化学腐蚀牺牲层的方法实现电极翻转以制作反面电极。同时采用了一种基于应力集中的凹槽结构,以保证所得微电极形状的规整性。微电极的SEM和电学性能测试结果表明,微电极的结构形貌和电学性能满足植入式电极的要求。To implement the minimal invasive implantation and improve the recording or stimulation resolution of neural microelectrodes, a method was proposed to fabricate the implantable and flexible double-side polymer-based microelectrodes for neural application. A photosensitive polyimide (Durimide 7510) was used as the substrate materials and a local adhesive bonding technology combined with the method of eroding the sacrifice layer by electrochemical etching was used to turn over the polyimide foil and fabricate of the back side of a flexible electrode. Simultaneously, a groove configuration based on the stress conglomeration was employed to ensure the regularity of the microelectrodes. The surface topographies and electrical properties of the microelectrodes were characterized by scanning electron microscopy and electrochemical method and the results show the topographies and properties of them can meet the conditions of implantable microelectrodes.

关 键 词：神经工程 植入式微电极 柔性微电极 双面微电极 

分 类 号：TP212.3[自动化与计算机技术—检测技术与自动化装置] R197.39[自动化与计算机技术—控制科学与工程]