THERMAL PROCESS OF VACUUM FLUXLESS LASER SOLDERING AND ANALYSIS ON SOLDER SPREADING AND WETTING  

作　　者：Wang Chunqing Li Mingyu SunFujiang Feng Wufeng (National key laboratory of welding, Harbin Institute of Technology) 

出　　处：《Chinese Journal of Mechanical Engineering》2000年第2期127-133,共7页中国机械工程学报（英文版）

基　　金：This project is supported by National Natural Science Foundation of China !(59671063)

摘　　要：In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both fluxless Sn-Pb solder in the vacuum surroundings and flux Sn-Pb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder surface tension is the important factor achieving fluxless laser soldering.In order to study the mechanism of vacuum fluxless soldering on the conditions of laser heating, the method of measuring temperature by the thermocouple is used to analyze the spreading and wetting process of both fluxless Sn-Pb solder in the vacuum surroundings and flux Sn-Pb solder on Cu pad. Solder spreading and wetting affected by the soldering thermal process is also discussed according to the thermodynamics principle. Results show that vacuum fluxless soldering demands higher temperature, and the fall of the solder surface tension is the important factor achieving fluxless laser soldering.

关 键 词：Fluxless soldering Soldering thermal process Spreading and wetting 

分 类 号：TG42[金属学及工艺—焊接]