光电多芯片模块及其在高速计算机和光通信网络中的应用  

Optoelectronic Multichip Modules and Its Application in High-speed Computer and Optical Communication Networks

作　　者：孙亚春[1] 王庆康[1] 

机构地区：[1]上海交通大学微电子研究所,上海200030

出　　处：《半导体光电》2002年第6期386-390,共5页Semiconductor Optoelectronics

摘　　要：为了改善高速计算机和通信网络中的通信延迟和连通性能 ,从 2 0世纪 90年代初的光电子单片集成到 90年代末的光电多芯片模块 ,人们在这一领域进行了很多研究。根据国际上近年来的相关研究报道 ,介绍了光电多芯片模块 (OE MCM )的结构 ,并阐述了其制造工艺及其在高速计算机和通信网络中的应用。To improve the capability of communication delay and connectivity in high speed computer and communication networks,people have made much research in the field from optoelectronic monolithic integration at the beginning of 1990s to OE MCM at the end of 1990s.The structure and fabrication process of OE MCMs are demonstrated based on the correlative research reports in the last few years. Finally, the applications of OE MCMs in high speed computer and communication networks are proposed.

关 键 词：微光电机械系统 光电多芯片模块 光电互连 金属-半导体-金属光电探测器 

分 类 号：TN256[电子电信—物理电子学]